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TTTC's Electronic Broadcasting
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22nd International Mixed-Signal
Testing Workshop |
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SUBMISSION DEADLINE
APPROACHING: March 17, 2017
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CALL FOR PAPERS
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The International Mixed-Signals Testing Workshop is a forum that brings together this community to discuss ideas and views on the following topics, among others: Test generation Fault modeling and simulation Test metrics estimation Self-healing and self-adaptation Built-in self-test Design-for-test Fault diagnosis Failure analysis Defect characterization ATE technology Economics of test and yield optimization On-line test Fault tolerance Reliability and design-for-reliability |
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Submissions should be via the workshop web-site and consist of either an extended summary of at least 750 words or preferably a complete 6-page paper. The workshop will produce electronic formal proceedings with an ISBN number which will become available in the IEEE Xplore digital library. A selection of papers will be invited to a special issue of Elsevier Journal of Electronic Testing: Theory and Applications (JETTA). All submissions are to be made electronically through the submission Web site: https://easychair.org/conferences/?conf=imstw17 Notice that only submissions of PDFs are allowed. |
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Submission deadline: March 17, 2017 Notification of acceptance: April 3, 2017 Camera-ready full paper: May 8, 2017 |
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| Additional Information | |
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For second consecutive year IMSTW'17 will be held as part of the Federative Event on Design for Robustness (FEDfRo). With a single registration, attendees will be able to access the sessions of three events: IOLTS: International Symposium on On-Line Testing and Robust System Design IMSTW: the International Mixed-Signal Testing Workshop IVSW: the International Verification and Security Workshop For all details about the organization of these joint events please visit: http://tima.imag.fr/conferences/fedfro/fedfro17/ |
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| Committee | |
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General Chair G. Leger, IMSE, ES Program Chairs M. Barragan, TIMA, FR K. Huang, San Diego State U., USA Financial Chair E. Simeu, TIMA, FR Publication Chair A. J. Ginés, U. Sevilla, ES Program Committee J. Altet, UPC, ES L. Balado, UPC, ES I. Bell, U. of Hull, UK S. Bernard, LIRMM, FR A. Chatterjee, Georgia Tech, USA M. Comte, LIRMM, FR W. Eisenstadt, U Florida, USA O. Eliezer, EverSet Tech., USA A. J. Gines, IMSE, ES J. Goes, U. Nova de Lisboa, PT N. Horta, IST Lisboa, PT J. Huang, Nat. Tawan U., TW V. Kerzérho, LIRMM, FR H. Kobayashi, Gunma U., JP M.-M. Louerat, University Pierre & Marie Curie, LIP6, FR J. Machado da Silva, U. Porto, PT Y. Makris, U. Texas Dallas, USA L. Milor, Georgia Tech, USA S. Mir, TIMA, FR S. Natarajan, Intel, USA M. Po-Hung Lin, National Chung Cheng University, TW S. Rowling, TI, USA S. Sattler, Erlangen U., DE S. Sen, Purdue University, US M. Slamani, Global Foundries, USA H. Stratigopoulos, LIP6, FR H. M. von Staudt, Dialog Sem., DE S. Sunter, Mentor Graphics, USA F. Taenzler, TI, USA Y. Tsiatouhas, U. of Ioannina, GR D. Vazquez, U. Sevilla, ES |
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For more information, visit
us on the web at: http://tima.imag.fr/conferences/imstw/imstw17/
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The CONFERENCE is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC). |
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IEEE Computer Society- Test
Technology Technical Council
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